发明名称 Method for fabricating conformal electrodes using non-wettable surface and liquid metal
摘要 A diode device is disclosed that comprises a non-wettable electrode, a wettable electrode and a liquid metal disposed between the electrodes. The diode device may additionally comprise a non-wettable housing, preferably cylindrical. The diode device may additionally comprise a piston means able to change a volume of the liquid metal. In a preferred embodiment, the liquid metal has a low work function. The low function metal may be, for example, cesium. In a preferred embodiment, the liquid metal contains gallium.
申请公布号 US2008088040(A1) 申请公布日期 2008.04.17
申请号 US20070974313 申请日期 2007.10.12
申请人 TAVKHELIDZE AVTO;TALIASHVILI ZAZA 发明人 TAVKHELIDZE AVTO;TALIASHVILI ZAZA
分类号 H01L23/58 主分类号 H01L23/58
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