METHODS AND SYSTEMS FOR WAFER LEVEL PACKAGING OF MEMS STRUCTURES
摘要
<p>A method of forming a package for a MEMS structure coupled to a substrate includes depositing an encapsulant material on the substrate and patterning the encapsulant material to form a plurality of encapsulated structures. The method also includes depositing a first capping layer on the substrate and forming one or more release hole patterns in the first capping layer. The method further includes removing the encapsulant material and depositing a second capping layer.</p>
申请公布号
WO2008085779(A1)
申请公布日期
2008.07.17
申请号
WO2007US89115
申请日期
2007.12.28
申请人
MIRADIA INC.;YANG, XIAO;PAYNE, JUSTIN;WANG, YUXIANG;JI, WOOK;WANG, YE
发明人
YANG, XIAO;PAYNE, JUSTIN;WANG, YUXIANG;JI, WOOK;WANG, YE