| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame which can suppress the generation of a resin burr at the time of resin sealing without using a special die, and to provide a semiconductor device and its manufacturing method. <P>SOLUTION: The semiconductor device 1 comprises a semiconductor chip 10, an island 20 having an upper surface S1 mounted with the semiconductor chip 10 and a lower surface S2 opposite to the upper surface S1, a suspension pin 30 coupled with the island 20 and holding the island 20, and a branch 40 from the suspension pin 30. The branch 40 is inclined toward the lower surface S2 of the island 20. <P>COPYRIGHT: (C)2008,JPO&INPIT |
