| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device for electronic component mounting that can correctly detect thickness abnormality of a substrate and prevent a height position error and a flatness defect of the substrate due to the thickness abnormality, and to provide a substrate underside supporting method of the device for mounting the electronic component. <P>SOLUTION: In substrate underside supporting operation wherein an elevation member 24 is elevated so as to receive and support the underside of the substrate by a substrate underside supporting portion provided to the device for electronic component mounting, it is determined that the thickness of a substrate currently clamped between a movable clamp member and a fixed clamp member is abnormal and that is notified when a photosensor 29 outputs a detection signal before a height position of the elevation member 24 reaches a lower detection limit position set below a reference detection height position Hs or when no detection signal is output even after an upper detection limit position UL set above the detection reference height position Hs is reached. <P>COPYRIGHT: (C)2009,JPO&INPIT |
