发明名称 |
Method and apparatus for deploying a liquid metal thermal interface for chip cooling |
摘要 |
In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an integrated circuit chip or an opposing surface of a heat sink) includes applying an adhesive to the interface surface. A metal film is then bonded to the adhesive, thereby easily adapting the interface surface for bonding to the liquid metal.
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申请公布号 |
US7482197(B2) |
申请公布日期 |
2009.01.27 |
申请号 |
US20050220878 |
申请日期 |
2005.09.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FURMAN BRUCE K.;MARTIN YVES C.;VAN KESSEL THEODORE G. |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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