发明名称 MULTILAYER CHIP CAPACITOR, CIRCUIT BOARD APPARATUS HAVING THE CAPACITOR, AND CIRCUIT BOARD
摘要 Provided is a multilayer chip capacitor including a capacitor body having first and second capacitor units arranged in a lamination direction; and a plurality of external electrodes formed outside the capacitor body. The first capacitor unit includes at least one pair of first and second internal electrodes disposed alternately in an inner part of the capacitor body, the second capacitor unit includes a plurality of third and fourth internal electrodes disposed alternately in an inner part of the capacitor body, and the first to fourth internal electrodes are coupled to the first to fourth external electrodes. The first capacitor unit has a lower equivalent series inductance (ESL) than the second capacitor unit, and the first capacitor unit has a higher equivalent series resistance (ESR) than the second capacitor unit.
申请公布号 US2009059469(A1) 申请公布日期 2009.03.05
申请号 US20080198342 申请日期 2008.08.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE BYOUNG HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DONG SEOK;PARK SANG SO;PARK MIN CHEOL
分类号 H01G4/06;H01G4/228;H05K7/00 主分类号 H01G4/06
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