| 摘要 |
An attachment mechanism for connecting a cooling device with a component to be cooled and carried by a connector is disclosed. The attachment mechanism includes a plate, a bore that connects with a portion of the cooling device, a hinge that can be removably hinged on the connector, and a latch assembly that includes tilt relief profiles that allow the latch assembly to pivot on the plate so that a latch profile on the latch assembly can be removably latched on the connector. The latch assembly further includes a spring locator and a spring that are positioned within a slot in the latch assembly and hold the spring pre-loaded in compression. When the latch assembly is tilted on the plate, the latch profile is pivoted outward to facilitate latching onto the connector. After latching onto the connector, the spring is further compressed and exerts a load between the cooling device and the component to be cooled such that contact resistance is reduced and thermal transfer is increased. The magnitude of the load force can be increased or decreased by selection of the springs properties. The latch assembly can include a handle adapted to be gripped by a hand so that the latch assembly can be latched or unlatched with the connector without the use of tools.
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