发明名称 |
CIRCUIT STRUCTURE BODY, ELECTRIC CONNECTION BOX, AND MANUFACTURING METHOD OF CIRCUIT STRUCTURE BODY |
摘要 |
PROBLEM TO BE SOLVED: To suppress reduction of heat dissipation while facilitating handling of a circuit board.SOLUTION: A circuit structure body 20 comprises: a circuit board 24 including an insulation substrate 25 with which a conducting path is formed on a dielectric plate, and a plurality of bus bars 27A-27D which are stuck on one side of the insulation substrate 25; an insulation layer 31 which is printed on the plurality of bus bars 27A-27D in such a manner that neighboring ones of the plurality of bus bars 27A-27D are connected; a heat dissipation member 34 that overlaps the insulation layer 31 and dissipates heat conducted from the insulation layer 31; and a fixing member 40 for fixing the circuit board 24 and the heat dissipation member 34 while holding the insulation layer 31 between the plurality of bus bars 27A-27D and the heat dissipation member 34.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016134956(A) |
申请公布日期 |
2016.07.25 |
申请号 |
JP20150006684 |
申请日期 |
2015.01.16 |
申请人 |
AUTO NETWORK GIJUTSU KENKYUSHO:KK;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD |
发明人 |
TSUNODA TATSUYA |
分类号 |
H02G3/16;H05K7/20 |
主分类号 |
H02G3/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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