| 摘要 |
PROBLEM TO BE SOLVED: To suppress the consumption amount of cutting water when it is required to jet water from a fluid nozzle and guide an end material in a wafer case to a drainage portion in a cutting process using a cutting device.SOLUTION: In a cutting device 1, water is jetted from a fluid nozzle 8 in which water is jetted to a drainage port 75 in a water case 7 having the drainage port 75 for receiving sawdust C and an end material M and discharging water, thereby fluidizing the sawdust C and the end material M. A circulation system 9 contains a tank 90 for storing used cutting water F which contains the sawdust C and the end material M and is drained from the drainage port 75, a circulation pump 91 for supplying a pump-up fluid nozzle 8 with the used cutting water F from which at least the end material M is removed, and a water feeding pipe 92 for feeding the used cutting water F pumped up by the circulation pump 91 to the fluid nozzle 8. The used cutting water F circulated by the circulation system is used as the water jetted from the fluid nozzle 8.SELECTED DRAWING: Figure 2 |
