发明名称 |
MICROELECTRONIC DICE HAVING CHAMFERED CORNERS |
摘要 |
A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when the microelectronic die is incorporated into a microelectronic package. In one embodiment, a microelectronic die may include at least one substantially planar chamfering side extending between at least two adjacent sides of a microelectronic die. In another embodiment, a microelectronic die may include at least one substantially curved or arcuate chamfering side extending between at least two adjacent sides of a microelectronic die. |
申请公布号 |
KR20160098034(A) |
申请公布日期 |
2016.08.18 |
申请号 |
KR20160002655 |
申请日期 |
2016.01.08 |
申请人 |
INTEL CORPORATION |
发明人 |
DUBEY MANISH;ARMAGAN EMRE;DIAS RAJENDRA C.;SKOGLUND LARS D. |
分类号 |
H01L25/11;H01L21/56;H01L23/13;H01L23/31;H01L25/07 |
主分类号 |
H01L25/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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