Film insert molding for device manufacture

摘要

Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.

主权项

1. A method of constructing a device comprising:
forming a film into a shape that defines an interior region; disposing an electronic component within the interior region of the film; incorporating an additive into a thermo-set resin, wherein the additive is configured to absorb, store and distribute heat generated by the electronic component during operation of the device, and wherein the resin includes a castable material; substantially filling the interior region of the film with the thermo-set resin, wherein the thermo-set resin encompasses the electronic component; and hardening the thermo-set resin.