发明名称 Multi-layer micro-wire structure
摘要 A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking.
申请公布号 US9426885(B2) 申请公布日期 2016.08.23
申请号 US201414261465 申请日期 2014.04.25
申请人 EASTMAN KODAK COMPANY 发明人 Spath Todd Mathew;Cok Ronald Steven
分类号 H05K1/09;H05K3/24;G06F3/044;G06F3/041;H05K1/18 主分类号 H05K1/09
代理机构 代理人 Owens Raymond L.;Spaulding Kevin E.
主权项 1. A multi-layer micro-wire structure resistant to cracking, comprising: a substrate having a surface; one or more micro-channels formed in the substrate; an electrically conductive first material composition forming a first layer located in each micro-channel; and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, wherein the first material composition is susceptible to cracking when the multi-layer micro-wire structure is flexed such that gaps are formed in the first material composition, and wherein the second material composition forms an electrical connection that bridges the formed gaps, whereby the multi-layer micro-wire is resistant to cracking.
地址 Rochester NY US