发明名称 |
Multilayer sheet, back sheet for solar cells and solar cell module |
摘要 |
Provided are a multilayer sheet superior in weather resistance, heat resistance, and moisture proofness and also favorable in interlayer adhesiveness, and a back sheet for solar cells and a solar cell module prepared by using the same. The multilayer sheet 10 is prepared by laminating a polyolefin-based resin layer 1 having a melt flow rate, as determined by the method A specified in JIS K7210, of 0.5 to 25 g/10 minutes at 230° C. under a load of 2.16 kg and a polyvinylidene fluoride-based resin layer 2 having a melt flow rate, as determined by the method A specified in JIS K7210, of 0.5 to 25 g/10 minutes at 230° C. under a load of 2.16 kg, via an adhesion resin layer 3 of a conjugated diene-based polymer, a conjugated diene-based copolymer, or the hydride thereof having a melt flow rate, as determined by the method A specified in JIS K7210, of 0.1 to 50 g/10 minutes at 230° C. under a load of 2.16 kg. A back sheet prepared by using the multilayer sheet 10 is layered on a sealing material of a solar cell, to give a solar cell module. |
申请公布号 |
US9450129(B2) |
申请公布日期 |
2016.09.20 |
申请号 |
US201314373017 |
申请日期 |
2013.01.17 |
申请人 |
Denka Company Limited |
发明人 |
Saito Tomoo;Arai Toru |
分类号 |
B32B27/00;H01L31/048;B32B27/32;B32B7/12;B32B27/08;B32B27/30;H01L31/042;H01L31/049 |
主分类号 |
B32B27/00 |
代理机构 |
Stein IP, LLC |
代理人 |
Stein IP, LLC |
主权项 |
1. A multilayer sheet, comprising:
a first resin layer of a polyolefin-based resin composition having a melt flow rate, as determined by the method A specified in JIS K7210, of 0.5 to 25 g/10 minutes at 230° C. under a load of 2.16 kg; a second resin layer of a polyvinylidene fluoride-based resin composition having a melt flow rate, as determined by the method A specified in JIS K7210, of 0.5 to 25 g/10 minutes at 230° C. under a load of 2.16 kg; and an adhesion resin layer of a conjugated diene-based polymer, a conjugated diene-based copolymer, or the hydride thereof having a melt flow rate, as determined by the method A specified in JIS K7210, of 0.1 to 50 g/10 minutes at 230° C. under a load of 2.16 kg, wherein the first and second resin layers are laminated via the adhesion resin layer. |
地址 |
Tokyo JP |