发明名称 HEAT-RESISTANT RESIN MOLDING MATERIAL
摘要 PURPOSE:To obtain the titled molding material having excellent moldability and forming no burn mark in molding, by compounding specific amounts of an organic peroxide and a liquid having a boiling point of <=90 deg.C to a molding material composed of a bismaleimide, an aromatic diamine and glass fiber. CONSTITUTION:A molding material composed of (A) a bismaleimide (e.g. maleic acid N,N'-ethylenebisimide), (B) an aromatic diamine (e.g. 4,4'-diami nodiphenylmethane) and (C) glass fiber at a molar ratio (A/B) of 2-5 is com pound with (D) 0.2-2pts.wt. of an organic peroxide (e.g. benzoyl peroxide) based on 100pts.wt. of the component A. The obtained composition is further compounded with (E) 0.5-10wt% liquid having a boiling point of <=90 deg.C (e.g. methanol). The addition of the component E is effective in preventing the forma tion of burn mark in molding.
申请公布号 JPS62250034(A) 申请公布日期 1987.10.30
申请号 JP19860093020 申请日期 1986.04.22
申请人 SHIN KOBE ELECTRIC MACH CO LTD 发明人 TAGAMI YOSHITAKA
分类号 C08G73/12;C08G73/10;C08K5/14;C08K7/14;C08K13/04;C08L79/08 主分类号 C08G73/12
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