SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

摘要

PURPOSE: To provide a semiconductor device which is miniaturized by reducing the number of external power terminals while suppressing power noise, and an electronic device in which a bypass capacitor is efficiently packaged. CONSTITUTION: The device is provided with a package substrate in which a semiconductor chip having a plurality of output circuits and an electrode for supplying voltages to the output circuits is packaged on the front face, and an external terminal is provided on the rear face having a plurality of wiring layers. On the front face of the package substrate, the device is provided with a second electrode connecting one terminal to the electrode of the semiconductor chip, a first wiring means for commonly connecting respective second electrodes while including a wiring layer different from the wiring layer on the front face, a second wiring means for connecting a first electrode and correspondent one of external terminals provided on the rear face, and a plurality of third wiring means for connecting the first wiring means to a plurality of external terminals of a number summarized into a number less than that of second electrodes provided on the rear face.