| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which stress buffer performance is improved, Pb free solder can be adopted and further, a package for housing a semiconductor element can be downsized. SOLUTION: This device has a semiconductor chip 1, an insulating film formed on the surface of the semiconductor chip, a plurality of projection-like stress buffers 2 formed on the insulating film, projecting electrodes 3 covering at least tops of the stress buffers, and wires 4 for electrically connecting the projecting electrodes and the elementary electrodes of the semiconductor chip. |
