PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR CURING SOLDERING RESIST COATING FILM USING THE SAME AND SOLDERING RESIST COATING FILM

摘要

PURPOSE:To form a cured coating film excellent in characteristics and to unnecessitate a post-heat curing process or to enable changeover from post-heat curing to curing with active energy beams by using an org. peroxide having a carbonyl group in each molecule. CONSTITUTION:An org. peroxide having at least one carbonyl group in one molecule is used in this photosensitive resin compsn. A photosensitive component used has at least two unsatd. groups in one molecule and is, e.g. bisphenol A type epoxy resin provided with photosensitivity by adding unsaid. monocarboxylic acid such as acrylic acid, a resin provided with alkali solubility by introducing carboxyl groups by the addition of a dibasic acid anhydride such as maleic anhydride or an arom. polycarboxylic acid anhydride such as trimellitic anhydride or a resin obtd. by introducing unsatd. groups such as acryloyl groups into a (co)polymer of styrene or acrylic acid.