| 摘要 |
A substrate (104) having a planar conductive plating (106) located on a first surface of a dielectric layer (108) and having a conductive collection trace (110) on a second surface of the dielectric layer (108) such that the conductive plating (106) and collection trace (110) have a parallel, spaced apart relation. The collection trace (110) is charged by supplying a voltage to the plating (106) and the trace (110) to establish a voltage differential across the dielectric layer (108). The material to be deposited (116) is charged to a polarity opposite that of the trace (110) so that the deposited material (102) is electrostatically retained. |
