| 摘要 |
PCT No. PCT/FR97/01510 Sec. 371 Date Feb. 23, 1999 Sec. 102(e) Date Feb. 23, 1999 PCT Filed Aug. 21, 1997 PCT Pub. No. WO98/08363 PCT Pub. Date Feb. 26, 1998A method for manufacturing a device to dissipate the thermal energy produced by electronic components embedded in a printed circuit card, such method consisting in depositing on the card a first layer of a first thermally conductive and electrically insulating material to cover at least the connecting tabs for the electronic components to be cooled, and putting this first layer in contact with a metallic drain connected to a thermal mass to drain the calories towards the exterior of the card, wherein the method consisting is making the drain in the form of a flexible porous metallic structure, and in depositing on the drain a second layer of a second material that adheres to the first layer through the pores of the drain to hold the latter in place on the card. |
