| 发明名称 |
Semiconductor device manufacturing method and semiconductor device |
| 摘要 |
In a semiconductor device manufacturing method for forming a rerouting layer, which has wirings for leading electrically electrode terminals and bonding pads, on a major surface side on which the electrode terminals of a semiconductor element are provided, the wirings are formed thinner than the bonding pads.
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| 申请公布号 |
US2003089868(A1) |
申请公布日期 |
2003.05.15 |
| 申请号 |
US20020287636 |
申请日期 |
2002.11.05 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
ITO DAISUKE;KAZAMA TAKUYA |
| 分类号 |
H01L23/52;H01L21/3205;H01L21/60;H01L23/485;H01L23/525;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):F16K35/00 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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