| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method which can perform an inspection for the transmission abnormality of a self-scanning type light-emitting element array chip without providing a bonding pad for the end terminal. <P>SOLUTION: The self-scanning type light-emitting element array chip is equipped with a transmission section being constituted by single-dimensionally arranging a plurality of three terminal light-emitting thyristors for transmission, and a light-emitting section being constituted by single-dimensionally arranging a plurality of three terminal light-emitting thyristors for light emission. For this optical writing head, a plurality of the self-scanning type light-emitting element array chips are single-dimensionally arranged. In the optical writing head, an ammeter J is inserted in the power source line for each chip, and a current flowing on the power source line is measured by the ammeter by a timing in which the last thyristor only from among a plurality of the thyristors for transmission being arranged is turned on, and a light-emitting abnormality is detected by the measured value for each chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
