CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION FOR POLISHING POLY-SILICON FILM

摘要

A chemical mechanical polishing slurry composition for polishing poly-silicon films is provided to solve a dishing problem and have excellent polishing uniformity and high selectivity. The chemical mechanical polishing slurry composition for polishing poly-silicon films comprises (a) a metal oxide, (b) a quaternary ammonium base compound, and (c) an ionic polymer. The ionic polymer is contained in an amount of 0.001-1wt% based on the total slurry composition. The ionic polymer is at least one selected from polyacrylic acid, poly(acrylic acidco-maleic acid), and poly(acylamide-co-acrylic acid).