METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To prevent the displacement of a dam bar caused by the injection pressure of resin at mold-forming in manufacturing of semiconductor apparatus which seals two semiconductor chips to a single package with resin using two lead frames. SOLUTION: A short dummy lead 7 which is present at a direction of the width of a dam bar 6 is formed at the side of the dam bar 6 of a second lead frame LF2. The dummy lead 7 is formed only at the central part of a space region of a lead 1, and is not formed at both ends of the space region (in the neighborhood of the lead 1). This leads to that the dam bar 6 has a larger width by the length of the dummy lead 7 at the central part of the space region of the lead 1 and also has a smaller width at the both ends of the space region (in the neighborhood of the lead 1). COPYRIGHT: (C)2007,JPO&INPIT