Electronic semiconductor-component encapsulation method, involves manufacturing part of frame by selective contactless application of components of coating materials on substrate in print head and by annealing of coating materials

摘要

The method involves providing a function substrate i.e. function wafer (1), and arranging a plastic frame and a cover element on the function substrate on a side (10) in an electronic semiconductor-component (3). The frame or a function area of the semiconductor-component is enclosed such that a cavity is formed. A part of the frame is manufactured by selective contactless application of components of coating materials on the substrate in a computer-controlled ink jet print head (9) and by annealing of the coating materials. An independent claim is also included for a wafer composite for manufacturing an encapsulated electronic semiconductor-component.