| 摘要 |
A light emitting diode package assembly is provided including a lower housing element and an upper housing element creating an internal pcb storage chamber. A light emitting diode driver pcb is mounted within. A light emitting diode pcb is mounted within and includes a light emitting diode element and a touch switch antenna. A personality pcb mounted is within between the light emitting diode driver pcb and the light emitting diode pcb. The personality pcb comprises touch switch circuitry and theatre dimming circuitry. At least one pcb interconnect places the light emitting diode driver pcb, the light emitting diode pcb and the personality pcb in communication with each other. |
