PURPOSE: A bonding control system and a control method thereof are provided to improve effectiveness of bonding operation by minimizing movement of a bonding control device, and to control the bonding operation effectively. CONSTITUTION: A glue discharging device(106) supplies an adhesive through a glue hose according to discharge information. A bonding device(104) offers an error generating signal of the glue discharging device in bonding operation. A bonding control device(102) control the bonding device through serial communications, and monitors an error of the device. The bonding control device includes a monitoring part and a handling part controlling bonding operation.
申请公布号
KR20090126446(A)
申请公布日期
2009.12.09
申请号
KR20080052532
申请日期
2008.06.04
申请人
SAMSUNG HEAVY IND. CO., LTD.
发明人
LEE, DONG BAE;CHOI, JONG UNG;HAN, SUNG HO;HAN, SEONG JONG;KIM, HONG GYEOUM