发明名称 BONDING CONTROL SYSTEM AND ITS CONTROL METHOD
摘要 PURPOSE: A bonding control system and a control method thereof are provided to improve effectiveness of bonding operation by minimizing movement of a bonding control device, and to control the bonding operation effectively. CONSTITUTION: A glue discharging device(106) supplies an adhesive through a glue hose according to discharge information. A bonding device(104) offers an error generating signal of the glue discharging device in bonding operation. A bonding control device(102) control the bonding device through serial communications, and monitors an error of the device. The bonding control device includes a monitoring part and a handling part controlling bonding operation.
申请公布号 KR20090126446(A) 申请公布日期 2009.12.09
申请号 KR20080052532 申请日期 2008.06.04
申请人 SAMSUNG HEAVY IND. CO., LTD. 发明人 LEE, DONG BAE;CHOI, JONG UNG;HAN, SUNG HO;HAN, SEONG JONG;KIM, HONG GYEOUM
分类号 B05B12/00;B05B15/00 主分类号 B05B12/00
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