| 摘要 |
PURPOSE: A thinner composition for removing resist is provided, which is used to remove the edge part of resist film coated on a substrate or an unnecessary film component formed on the back face of a substrate in manufacturing process of a TFT-LCD device or a semiconductor device. CONSTITUTION: The thinner composition comprises 0.1-10 wt% of an inorganic and/or organic alkali; 0.1-30 wt% of an organic solvent; 0.01-10 wt% of a nonionic surfactant; 50-99 wt% of water; and optionally 0.01-5 wt% of an anionic surfactant and/or 0.01-1.0 wt% of an antifoaming agent. Preferably the organic solvent is an organic amine-based solvent, an alcohol ether-based organic solvent, a nitrogen-containing organic solvent or a sulfur-containing organic solvent; the nonionic surfactant is selected from the group consisting of polyoxy ethyl ether, polyoxy propyl ether, polyoxy ethyl propyl ether, polyoxy ethyl alkyl phenyl ether, polyoxy propyl alkyl phenyl ether, polyoxy ethyl oxypropyl alkyl phenyl ether and their mixtures; and the anionic surfactant is selected from the group consisting of alkyl ether sulfate, alkyl sulfate, alkyl benzenesulfonic acid, alkyl benzenesulfonate, alkyl naphthalene sulfonate and their mixtures. |
