| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor package that can be downsized and thinned in height as securing a detection performance.SOLUTION: A sensor package comprises: a pressure detection unit; an IC substrate to which a detection result by the pressure detection unit is input; and a case that has a storage space storing the pressure detection unit inside. The IC substrate is arranged so as to cover an opening part in a state having a gap introducing external air between an opening part of the storage space and the IC substrate. The IC substrate and the case are electrically connected by a plurality of bumps arranged apart from each other at an interval, and the pressure detection unit is electrically connected to the IC substrate via a conductive channel provided in the case, and the interval among the plurality of bumps forms a gap.SELECTED DRAWING: Figure 5 |
