Wiring substrate and semiconductor device

摘要

There is provided a wiring substrate. The wiring substrate includes: a wiring pattern of an outermost layer; a solder resist layer having an opening portion therein, wherein a portion of the wiring pattern is exposed through the opening portion, and the exposed portion of the wiring pattern is defined as a connection pad; and a solder bump on the connection pad. The connection pad includes: a solder layer; and a metal post that is entirely covered by the solder layer, wherein a portion of the solder layer is interposed between the connection pad and the metal post.

主权项

1. A wiring substrate comprising:
a wiring pattern of an outermost layer; a solder resist layer having an opening portion therein, wherein a portion of the wiring pattern is exposed through the opening portion, and the exposed portion of the wiring pattern is defined as a connection pad; and a solder bump on the connection pad and comprising:
a solder layer; anda metal post that is entirely surrounded by the solder layer, the metal post comprising a post portion and a large diameter portion on the post portion, a diameter of the large diameter portion being larger than that of the post portion in a plane view, wherein a bottom portion of the solder layer is interposed between the connection pad and the metal post, and wherein the post portion is extended from the large diameter portion toward the connection pad in a thickness direction of the wiring substrate.