发明名称 |
CU-GA ALLOY SPUTTERING TARGET, AND METHOD FOR PRODUCING SAME |
摘要 |
The present invention provides a sputtering target of a Cu—Ga sintered body in which the oxygen content is further reduced and the abnormal discharging can be suppressed, and a method for producing the same. The sputtering target according to the present invention is a sintered body having: a texture in which Na compound phases are dispersed in a matrix with a γ phase and a ζ phase of a Cu—Ga alloy; and a component composition made of: 20 atomic % to 30 atomic % of Ga; 0.05 atomic % to 10 atomic % of Na; and the Cu balance and inevitable impurities including elements other than Na in the Na compound, wherein an average grain size of the γ phase is 30 μm to 100 μm, and an average grain size of the Na compound phases is equal to or less than 8.5 μm. |
申请公布号 |
US2016208376(A1) |
申请公布日期 |
2016.07.21 |
申请号 |
US201414908346 |
申请日期 |
2014.07.25 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
Yoshida Yuuki;Ishiyama Kouichi;Mori Satoru |
分类号 |
C23C14/34;C22C9/00;C23C14/14;H01J37/34;B22F3/16;B22F5/00 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
1. A Cu—Ga alloy sputtering target that is a sintered body having:
a texture in which Na compound phases are dispersed in a matrix with a γ phase and a ζ phase of a Cu—Ga alloy; and a component composition made of: 20 atomic % to 30 atomic % of Ga; 0.05 atomic % to 10 atomic % of Na; and the Cu balance and inevitable impurities including elements other than Na in the Na compound, wherein an average grain size of the γ phase is 30 μm to 100 μm, and an average grain size of the Na compound phases is equal to or less than 8.5 μm. |
地址 |
Tokyo JP |