HOLDER FOR PLATING WAFER

摘要

The present invention relates to a holder for plating a wafer wherein a semiconductor chip formed to be driven through an electrode supports a number of array wafers. The holder of the present invention comprises: a base plate; at least one support bar combined to the base plate through a combining member, through a first and a second combining holes formed on the base plate separately from each other; and a pressurizing piece installed in the support bar to pressurize the wafer mounted on the base plate elastically. According to the holder for plating the wafer of the present invention, as an elastic bias is able to vertically be applied to the wafer and is able to be released, the holder provides an advantage of being able to suppress damage to the wafer and to easily adjust a position elastically contacting the wafer.