发明名称 |
Gehäuse für einen Halbleiterchip, Gehäuseverbund, Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
摘要 |
A housing for a semiconductor chip has a front side and a rear side opposite the front side, wherein the front side has a fastening area for the semiconductor chip; the rear side has a mounting area to mount the housing, wherein the mounting area runs obliquely to the fastening area; and the rear side has a resting area running parallel to the fastening area. |
申请公布号 |
DE112014005358(A5) |
申请公布日期 |
2016.08.04 |
申请号 |
DE20141105358T |
申请日期 |
2014.11.13 |
申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Haushalter, Martin;Haslbeck, Stephan |
分类号 |
H01L23/13;H01L33/48 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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