发明名称 |
METHOD OF MANUFACTURING ELEMENT, METHOD OF ARRAYING ELEMENT AND METHOD OF MANUFACTURING IMAGE DISPLAY DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing elements which can deal with the formation of microelements as well, and can easily connect the elements to the wiring disposed on the surface of a resin embedded with the elements and to provide a method of manufacturing an image display device using the same. <P>SOLUTION: Resin layers are formed by packing a resin to the circumferences of the elements arranged on the front surface of a release material layer and the elements and the peeling surfaces of the resin layers are formed flush with each other by peeling the resin layers from the release material layer, by which electrode pads and wiring are easily formed while the defect of connection is suppressed. <P>COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003162231(A) |
申请公布日期 |
2003.06.06 |
申请号 |
JP20010359780 |
申请日期 |
2001.11.26 |
申请人 |
SONY CORP |
发明人 |
DOI MASATO;IWABUCHI TOSHIAKI |
分类号 |
G09F9/33;G09F9/00;H01L33/32;H01L33/36 |
主分类号 |
G09F9/33 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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