发明名称 WAFER PROCESSING SYSTEM
摘要 The purpose of the present invention is to provide a wafer processing system capable of reducing unnecessary waiting time. The wafer processing system for processing a wafer includes; trays receiving the wafers; a conveyor returning the wafers received in the trays; first and second tray maintaining devices installed along the conveyor to be separated from each other, discharging the trays from the conveyor, and receiving the discharged trays in the conveyor; and first and second devices with processing means installed corresponding to the first and second tray maintaining devices and processing the wafers returned to the conveyor and receiving and discharging means receiving or discharging the wafers in/from the trays maintained by the first and second tray maintaining devices. The wafer processing system processes the wafer one by one.
申请公布号 KR20160099479(A) 申请公布日期 2016.08.22
申请号 KR20160011094 申请日期 2016.01.29
申请人 DISCO CORPORATION 发明人 SEKIYA KAZUMA
分类号 H01L21/677;H01L21/66 主分类号 H01L21/677
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