| 摘要 |
PURPOSE:To establish a multi-layered circuit board, in which there is employed an oxide superconducting material exhibiting superconduction at a relatively high temperature as an internal wiring material, by constructing, in the multi-layered circuit board, in which internal wiring conductor layers are formed among a plurality of insulator layers each comprising ceramics, the internal wiring conductor layer with a superconductor layer, and interposing a metal layer between the superconductor layer and the insulator layer. CONSTITUTION:In a multi-layered circuit board 3, wherein a plurality of insulator layers 1 each comprising ceramics are integrally superimposed, and an internal wiring conductor layer 2 is formed between adjacent insulator layers 1, the internal wiring conductor layer 2 is formed of a superconductor layer 4, and a metal layer 5 is interposed between the superconductor layer 4 and the insulator layer 1. For example, for a material of the superconductor layer 4 a superconducting material such as Y- Ba-Cu-O exhibiting superconduction at a relatively high temperature is employed, and for the metal layer 5 a material such as Ag-Pd alloy is employed. Additionally, for a ceramic material which forms the insulator layer 1, a material such as a low temperature sintered ceramic composition, which takes as chief ingredients 25-70% SiO2, 1-30% Al2O3, 1.5-5% B2O3, and 25-60% SrO, is employed. |
