发明名称 |
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
摘要 |
A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture may be constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board.
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申请公布号 |
US2003111766(A1) |
申请公布日期 |
2003.06.19 |
申请号 |
US20030358573 |
申请日期 |
2003.02.05 |
申请人 |
GOCHNOUR DEREK J.;MESS LEONARD E. |
发明人 |
GOCHNOUR DEREK J.;MESS LEONARD E. |
分类号 |
H05K3/28;H05K13/00;(IPC1-7):B29C70/88;B05D5/12 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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