| 摘要 |
PROBLEM TO BE SOLVED: To provide the good surface roughness and to increase the speed of a polishing removal. SOLUTION: A polishing device is provided with a first polishing tool 3 to be rotated and a second polishing tool 4 to be rotated by taking a rotational axis A of the first polishing tool 3 as the center axis, and provided with a hole through which a driving shaft 15 of the first polishing tool 3 is to be inserted and an opening space including the first polishing tool 3 mounted on the tip of the driving shaft 15 in the non-contact state, and is able to polish at least the axial symmetric curved surfaces and the free curved surface. |
