Halbleiteranordnung mit Kunststoffgehäuse und Wärmeverteiler

摘要

The invention relates to power semiconductor components (P-QFP) in which visible points of the integrated heat spreader (3) are required to check, firstly the quality of a soldering, and secondly to introduce the process heat for soldering via the heat spreader (3). Corresponding recesses (5) are provided for this purpose in the plastic housing (4) with the result that the side and partially the top of the heat spreader (3) are exposed on the narrow side of a QFP housing (1).