发明名称 Modular jack
摘要 A modular jack (1) assembled on a mother board comprises an insulative housing (2) with a receiving space (25, 26), a plurality of terminals (3, 4) received in the receiving space, and an electronic component (5, 6) assembled in the insulative housing for eliminating noise. The electronic component comprises a plurality of upper contacts (501, 601) for connecting with corresponding terminals and a plurality of lower contacts (503, 603) for connecting with the mother board.
申请公布号 US2003117778(A1) 申请公布日期 2003.06.26
申请号 US20010033663 申请日期 2001.12.26
申请人 KORSUNSKY IOSIF;WALKER KEVIN E.;HYLAND JAMES H. 发明人 KORSUNSKY IOSIF;WALKER KEVIN E.;HYLAND JAMES H.
分类号 H01R12/20;H01R13/66;H01R13/719;(IPC1-7):H05K7/00 主分类号 H01R12/20
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