发明名称 |
RESIN MOLDED CIRCUIT BOARD AND ITS MANUFACTURE, ELECTRICAL MACHINERY AND APPARATUS PROVIDED WITH RESIN MOLDED CIRCUIT BOARD AND ITS MANUFACTURE |
摘要 |
PROBLEM TO BE SOLVED: To obtain a resin molded circuit board, wherein resin is virtually prevented from sneaking into a soldered portion and circuit parts can be mounted later and connected by an automatic machine. SOLUTION: This resin molded circuit board 3 is formed by forming an insulating resin 10 a trench-shaped recess 18 for circuit part installation on the soldering face 9 side, where the circuit parts of a circuit board 8 are to be mounted for exposing the soldering face 9, providing holding holes 19 for holding the circuit board 8 by clamping on the side opposite to the recess 18, and resin-molding the entire workpiece using insulating resin 10 so that the circuit parts can be later installed to the soldering face 9 using the recess 18. |
申请公布号 |
JPH11252867(A) |
申请公布日期 |
1999.09.17 |
申请号 |
JP19980055349 |
申请日期 |
1998.03.06 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
DEGUCHI MANABU;TAKEKOSHI YUKINORI;KIMURA RYOICHI;ARAI TAKESHI;KIEDA KOUKI;MIYAGAWA HIDEAKI;IZAWA KAZUSHIGE;WAKITA KAKUJI |
分类号 |
H02K11/00;H02K15/12;H05K1/11;H05K3/20;H05K3/30 |
主分类号 |
H02K11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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