| 摘要 |
<p>An improved belt for mechanical polishing of semiconductor wafers, which belt maintains a substantially flat surface in the span between its mounting surfaces. The belt has at least one polymer layer including a polishing layer, and at least one woven or non-woven supporting layer. The symmetrical properties of the belt are arranged to achieve a balance between down-cupping and up-cupping forces exerted on the belt in the span between its mounting in order to prevent the edges of the belt cupping up or down.</p> |
