| 摘要 |
A test socket for testing an optical IC device in a dead bug orientation includes a socket body with a device under test cavity (DUT cavity) for receiving an optical IC device under test (optical DUT) in a contact-up or dead bug orientation. The DUT cavity has a bottom wall with at least one aperture through which the photoactive side of the optical DUT held in the cavity can be illuminated. An outer array of axial contact elements arranged about the DUT cavity provides conductive paths through the socket body. The test socket further includes a plunger assembly insertable into the DUT cavity of the socket body having an inner array of axial contact elements which extend through the plunger assembly and which are configured to provide contact with the contacts on the contact side of the optical DUT. A transverse conductor bridge at the top of the plunger assembly provides a transverse electrical path connecting the inner array of axial contact elements of the plunger assembly and the outer array of axial contact elements of the socket body when the plunger assembly is inserted into the DUT cavity. An electrical path is thereby provided between the contacts of the contact optical DUT and the bottom of the socket body mounted to the DUT board through the plunger assembly and socket body. |
