发明名称 UNDERFLOOR HUMIDITY CONDITIONING MATERIAL, UNDERFLOOR HUMIDITY CONDITIONING FLOOR PANEL AND UNDERFLOOR HUMIDITY CONDONING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an underfloor humidity conditioning material, an underfloor humidity conditioning floor panel and underfloor humidity conditioning structure not getting in the way in the maintenance of the underfloor of a building. SOLUTION: This underfloor humidity conditioning material 1 is provided with a plate like bag body 5 with a large number of air holes, horizontally mounted to the lower face 4a of the floor panel 4 or the lower face of a joist supported at the upper part of an underlfoor pace 3 of the building 2, and a crushed material 6 of charcoal filled in the bag body 5. The underfloor humidity conditioning floor panel is provided with the floor panel 4 and the underfloor humidity conditioning material 1 mounted to the lower face 4a of the floor panel 4, parallel with the face direction of the floor panel 4. In the underfloor humidity conditioning structure, the underfloor humidity conditioning material 1 is horizontally mounted to the lower face 4a of the floor panel 4 or the lower face of the joint supported to the upper part of the underfloor space 3 of the building 2.
申请公布号 JP2002155585(A) 申请公布日期 2002.05.31
申请号 JP20000355554 申请日期 2000.11.22
申请人 SEKISUI HOUSE LTD 发明人 NISHIDA MASAMI;MANABE KOKI
分类号 E04B1/64;E04B5/43;(IPC1-7):E04B1/64 主分类号 E04B1/64
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