| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board for electronic circuit unit wherein an insulated substrate has less warpage, electrical components are soldered with reliability, and solder stripping-off from electrical components is suppressed. SOLUTION: With respect to the circuit board for electronic circuit unit, a first conductive pattern 2 formed on one side of an insulated substrate 1 and a second conductive pattern 5 formed on the other side of the insulated substrate 1 are so formed that the total area of the first pattern and the total area of the second pattern are substantially equal to each other. Therefore, warpage that may occur in the insulated substrate 1 is reduced. As a result, electrical components are soldered with reliability during soldering operation for the electrical components, and solder stripping-off from the electrical components is eliminated in soldering to a motherboard and when in use.</p> |
