发明名称 METHOD OF FORMING A SILICON OXYNITRIDE LAYER
摘要 A SiO<SUB>x</SUB>N<SUB>y </SUB>gate dielectric and a method for forming a SiO<SUB>x</SUB>N<SUB>y </SUB>gate dielectric by heating a structure comprising a silicon oxide film on a silicon substrate in an atmosphere comprising NH<SUB>3 </SUB>and then exposing the structure to a plasma comprising a nitrogen source are provided. In one aspect, the structure is annealed after it is exposed to a plasma comprising a nitrogen source. In another aspect, a SiO<SUB>x</SUB>N<SUB>y </SUB>gate dielectric is formed in an integrated processing system by heating a structure comprising a silicon oxide film on a silicon substrate in an atmosphere comprising NH<SUB>3 </SUB>in one chamber of the integrated processing system and then exposing the structure to a plasma comprising a nitrogen source in another chamber of the integrated processing system.
申请公布号 US2007087583(A1) 申请公布日期 2007.04.19
申请号 US20060612276 申请日期 2006.12.18
申请人 APPLIED MATERIALS, INC. 发明人 OLSEN CHRISTOPHER;NOURI FARAN;CHUA THAI C.
分类号 H01L21/31;H01L21/28;H01L21/314;H01L29/51 主分类号 H01L21/31
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