| 摘要 |
A semiconductor device is provided to form a semiconductor device with high reliability by preventing cracks from being formed in a portion of a transparent member corresponding to a portion having an image region by a difference of thermal expansion coefficients of members for constituting a semiconductor device or stress resulting from expansion caused by moisture absorption of sealing resin. An image region(29) is formed on the upper surface of a semiconductor device. A transparent member(21) is separated from the semiconductor device by a predetermined length, confronting the semiconductor device. The end of the semiconductor device and the end surface of the transparent member are sealed by a sealing member. A groove part(26) is formed in the transparent member, positioned at the end surface of the transparent member corresponding to the outside of the outer edge of the image region of the semiconductor device. The end surface of the groove part can have a planar bottom surface and a lateral surface(26-1) almost vertical to the bottom surface. |
