发明名称 |
Rinsing processes and equipment |
摘要 |
Described are methods of rinsing and processing devices such as semiconductor wafers wherein the device is rinsed with using a surface tension reducing agent; the method may include a subsequent drying step which preferably incorporates the use of a surface tension reducing agent during at least partial drying; and the method may be performed using automated rinsing equipment; also described are automated rinsing apparatuses useful with the method.
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申请公布号 |
US7364625(B2) |
申请公布日期 |
2008.04.29 |
申请号 |
US20020152077 |
申请日期 |
2002.05.20 |
申请人 |
FSI INTERNATIONAL, INC. |
发明人 |
CHRISTENSON KURT K.;NELSON STEVEN L.;OIKARI JAMES R.;OLSON JEFF F.;WU BIAO |
分类号 |
B08B3/02;H01L21/00;H05K3/22;H05K3/26 |
主分类号 |
B08B3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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