发明名称 Semiconductor device having deep trench charge compensation regions and method
摘要 In one embodiment, a semiconductor device is formed in a body of semiconductor material. The semiconductor device includes a charge compensating trench formed in proximity to active portions of the device. The charge compensating trench includes a trench filled with various layers of semiconductor material including opposite conductivity type layers.
申请公布号 US7482220(B2) 申请公布日期 2009.01.27
申请号 US20060582889 申请日期 2006.10.19
申请人 SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C. 发明人 LOECHELT GARY H.;PARSEY, JR. JOHN M.;ZDEBEL PETER J.;GRIVNA GORDON M.
分类号 H01L21/8238 主分类号 H01L21/8238
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