SOLID POWER FORMULATIONS FOR THE PREPARATION OF RESIN-COATED FOILS AND THEIR USE IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS
摘要
The invention relates to solid thermosetting resin compositions and resin-coated foils, glass cloth reinforced resin-coated foils using the same and their use in the manufacturing of printed circuit boards.
申请公布号
WO2009074303(A1)
申请公布日期
2009.06.18
申请号
WO2008EP10473
申请日期
2008.12.10
申请人
ATOTECH DEUTSCHLAND GMBH;KRESS, JUERGEN;TUSL, STEPHAN;CICCHETTI, SANDRO;BECRET, THIERRY
