LOW COST PACKAGE WARPAGE SOLUTION

摘要

Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

主权项

1. A method for forming a device package, comprising:
forming a reinforcement layer over a substrate, wherein one or more openings are formed through the reinforcement layer; placing a device die into one of the openings; bonding the device die to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate.